New compositions of composite diffusion-hardening flux-free solders have been developed for connecting materials that have appreciably different thermal expansion coeffcients (TEC) and cannot withstand temperature jumps. The developed compositions allow the TEC to be varied over a wide temperature range.
The effect is achieved by introduction of components with low or negative TEC, with the alloy’s TEC remaining unchanged upon considerable temperature fluctuations (up to 500OC).
The soldered seam has an intermediate TEC value between those of the connected parts.
ADVANTAGES
The use of the paste-like compositions at room temperatures appreciably facilitates high-precision connection in the instrument making.
The developed technology for connecting heterogeneous materials contains a number of know-hows.
