Heat resistant inorganic silicate adhesive has long shelf life and low viscosity. The bonding strength and water resistance of the adhesive were improved by inorganic/organic hybrid process. The properties of the adhesive are as follows: （1）curing temperature：20-150℃ （2）heat-resistant temperature：1500℃ （3）shear strength:  ≥15MPa@ 20℃; ≥13MPa@800℃;      ≥10MPa@1000℃;≥5MPa@ 1500℃ （4）Shelf life:≥30min（Curing at 20℃），≥3h（Curing at 150℃）。